“Low Temperature Shallow Doping of Si by Silicide Snowplow through Polysilicon”, G. W. Rubloff and M. Wittmer, U.S. Patent No. 4,692,348, issued Sept. 8, 1987.
“Noncontact Full-Line Dynamic AC Tester for Integrated Circuits”, H. Beha, R. W. Dreyfus, and G. W. Rubloff, U.S. Patent No. 4,670,710, issued June 2, 1987.
“Photon Assisted Tunneling Testing of Passivated Integrated Circuits”, H. Beha, R. W. Dreyfus, A. M. Hartstein, and G. W. Rubloff, U.S. Patent No. 4,644,264, issued Feb. 17, 1987.
“Noncontact Dynamic Tester for Integrated Circuits”, H. Beha, R. W. Dreyfus, and G. W. Rubloff, U.S. Patent No. 4,706,018, issued November 10, 1987.
“Enhanced Adhesion Between Metals and Polymers”, P. S. Ho, P. O. Hahn, H. Lefakis, and G. W. Rubloff, U.S. Patent No. 4,720,401, issued January 19, 1988.
“Full Chip Integrated Circuit Tester”, H. Beha, R. W. Dreyfus, and G. W. Rubloff, U.S. Patent No. 4,703,260, issued October 27, 1987.
“Post-Oxidation Anneal of Silicon Dioxide”, K. Hofmann, G. W. Rubloff, and D. R. Young, U.S. patent no. 4,784,975, issued November 15, 1988.
“Photon Assisted Tunneling Testing of Passivated Integrated Circuits”, H. Beha, R. W. Dreyfus, A. M. Hartstein, and G. W. Rubloff, U.S. Patent No. 4,786,864, issued Nov. 22, 1988.
“Motive Structure for Transporting Workpieces”, M. Renier, S. M. Gates, M. Liehr, and G. W. Rubloff, U.S. Patent No. 4,794,863, issued January 3, 1989.
“Full Chip Integrated Circuit Tester”, H. Beha, R. W. Dreyfus, J. A. Kash, and G. W. Rubloff, U.S. Patent No. 4,845,425, issued July 4, 1989.
“Metal-Polymer Adhesion by Low Energy Bombardment”, P. O. Hahn, J. G. Clabes, P. S. Ho, H. Lefakis, and G. W. Rubloff, U.S. Patent No. 4,886,681, issued Dec. 12, 1989.
“High Area Capacitor Formation using Dry Etching”, G. S. Oehrlein and G. W. Rubloff, U.S. Patent No. 5,153,813, issued Oct. 6, 1992.
“High Area Capacitor Formation using Material Dependent Etching”, G. S. Oehrlein, V. V. Patel, A. Grill, R. T. Hodgson, and G. W. Rubloff, U.S. Patent No. 5,155,657, issued Oct. 13, 1992.
“Apparatus for Directional Low Pressure Chemical Vapor Deposition (DLPCVD)”, G. W. Rubloff and J. J. Hsieh, U.S. Patent No. 5,290,358, issued March 1, 1994.
“Full-Wafer Processing of Laser Diodes with Cleaved Facets”, T. Forster, C. Harder, A. Oosenbrug, and G. W. Rubloff, U.S. Patent No. 5,284,792, issued February 8, 1994.
“Method and Apparatus for Tuning Field for Plasma Processing using Corrected Electrode”, G. S. Selwyn, M. Dalvie, C. R. Guarnieri, J. J. McGill, G. W. Rubloff, and M. Surendra, U.S. Patent No. 5,716,486, issued February 10, 1998.
“Fabrication of rough silicon surfaces”, S. S. Dana, M. Anderle, G. W. Rubloff, A. G. Schrott, and M. Liehr, European Patent No. EP 0 567 748 B1, issued November 26, 1997.
“Acoustic Consumption Monitor”, C. A. Gogol, Jr., A. Wajid, and G. Rubloff, U.S. Patent No. 6,482,649 B1, issued Nov. 19, 2002.
“Spatially programmable microelectronics process equipment using segmented gas injection showerhead with exhaust gas recirculation”, Raymond A. Adomaitis, John N. Kidder, Jr., and Gary W. Rubloff, U.S. Patent No. 6,821,910, issued Nov. 23, 2004.
“Fabrication and Integration of Polymeric BioMEMS”, Jung Jin Park, Reza Ghodssi, Gary W. Rubloff, Mark Joseph Kastantin, Sheng Li, Li-Qun Wu, Hyunmin Yi, Theresa Michelle Valentine, U.S. Patent No. 7,375,404, issued May 20, 2008.
“Spatially Selective Deposition of Polysaccharide Layer onto Patterned Template”, William E. Bentley, Reza Ghodssi, Gregory F. Payne, Gary W. Rubloff, Li-Qun Wu, Hyunmin Yi, Wolfgang Losert, Douglas S. English, U.S. Patent No. 7,790,010, issued Sep. 7, 2010.
“Biolithographical Deposition and Materials and Devices formed therefrom”, Gregory F. Payne,, Gary W. Rubloff, Hyunmin Yi, Rohan Fernandes, Li-Qun Wu, Reza Ghodssi, and William E. Bentley, U.S. Patent No. 7.820,227, issued Oct. 26, 2010.
“Assembly of Chitosan onto an Electrode Surface”, Li-Qun Wu, Mark J. Kastantin, Hyunmin Yi, Gary W. Rubloff, William E. Bentley, Reza Ghodssi, Gregory F. Payne, Pub. No. US 2007/0172821, 7/26/2007, pending US 10/525241, Jan. 8, 2007.
“Controlled Electrochemical Deposition of Polysaccharide Films and Hydrogel and Materials Formed Therefrom”, Gregory F. Payne, Li-Qun Wu, Reza Ghodssi, William E. Bentley, Gary W. Rubloff, Hyunmin Yi, Rohan Fernandes, Tianhong Chen, David A. Small, U.S. Patent No. 7,883,615, issued Feb. 8, 2011.
“Lateral Two-Terminal Nanotube Devices and Method for their Fabrication”, Parag Banerjee, Sang Bok Lee, Israel Perez, Erin Robertson, Gary W. Rubloff, U.S. Patent No. 8,378,333 B2, issued Feb. 19, 2013.
“Nanodevice Arrays for Electrical Energy Storage, Capture and Management and Method for Their Formation”, Gary W. Rubloff, Sang Bok Lee, Israel Perez, Laurent Lecordier, Parag Banerjee, U.S. Patent No. 8,912,522, issued Dec. 16, 2014.
“Nanodevice Arrays for Electrical Energy Storage, Capture and Management and Method for Their Formation”, Gary W. Rubloff, Sang Bok Lee, Israel Perez, Laurent Lecordier, Parag Banerjee, U.S. Patent No. 10,032,569 B2, issued July 24, 2018.
“Protection Layers for Metal Anodes”, Alexander C. Kozen, Marshall A. Schroeder, Gary W. Rubloff, Liangbing Hu, Malakhi Noked, Sang Bok Lee, U.S. Patent No. 10,826,065, issued November 3, 2020.
“Multi-layer solid-state devices and methods for forming the same”, Gary W. Rubloff, Sang Bok Lee, Keith Gregorczyk, U.S. Patent App. 16 / 959,692, issued March 18, 2021.
