Dr. Gary W. Rubloff
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All materials at this site are copyrighted © 2003 by the University of Maryland
1996-2003, all rights reserved

Textbook
Silicon VLSI Technology: Fundamentals, Practice, and Modeling
James D. Plummer
Michael D. Deal
Peter B. Griffin, all of Department of Electrical Engineering, Stanford University


Published by Prentice Hall
Copyright 2001, 817 pp.
Cloth format
ISBN 0-13-085037-3

Click here to connect to publisher's web pages for the textbook

Textbooks were ordered and should be available in the campus bookstore under ENMA 465

Strengths for use in ENMA 465
  Overall, the book is up to date and presents current topics and perspectives (with a few exceptions)
  Each chapter considers the topic in several aspects, including:
    historical development and basic concepts
    manufacturing methods
    measurement methods
    models and simulation
    limits and future trends in technologies and models
  Serves as an excellent resource for semiconductor microelectronics, covering much more than the course can cover in a single semester
Modifications beyond textbook to accomplish goals of course
  Emphasize Cu/low-K/Damascene interconnect strategy
  Incorporate nanotechnology
  Separate processes into thermal and plasma, rather than deposition and etching

Table of Contents

Chap. 1. Introduction and Historical Perspective.
Chap. 2. Modern CMOS Technology.
Chap. 3. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers.
Chap. 4. Semiconductor Manufacturingó Clean Rooms, Wafer Cleaning and Gettering.
Chap. 5. Lithography.
Chap. 6. Thermal Oxidation and the Si/SiO 2 Interface.
Chap. 7. Dopant Diffusion.
Chap. 8. Ion Implantation.
Chap. 9. Thin Film Deposition.
Chap. 10. Etching.
Chap. 11. Backend Technology.